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Trade Show Directory:  Tokyo:  Jisso ProTec 2011


Jisso ProTec 2011

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Start Date 01-06-2011 End Date03-06-2011
Venue Tokyo Big Sight
City Tokyo Country Japan
Category Electronics & Electrical, Packaging, Plant & Machinery

Event Profile
Jisso ProTec 2011 is the most important trade event dedicated to process technology industry, in Japan. The event aims to provide complete range of equipment, systems, technologies for electronics packaging sector. It attracts industry renowned professionals at single arena, to explore new business opportunities and promote Japan’s process technology sector across international market. The 13th Jisso Process Technology Exhibition will provide a huge platform for exhibitors to highlight their latest products and valuable services, build brand goodwill and obtain good commercial deals. This show will exhibit a vast range of products including electronic components installed machines, packaging related equipment, packaging design systems, small electronic parts, packaging junction system, environment related devices & materials and many more. Jisso ProTec 2011 will be a splendid opportunity for participants and attendees to meet, network, build business contacts and create new trade associations for their business expansion.

Visitor Profile

The targeted visitors at Jisso ProTec 2011 are:
  • Researchers
  • Academicians
  • Managers
  • Technologists
  • Technical Companies
  • Electronics Company
  • Packaging Companies
  • Technical Experts
  • Industry Professionals
  • Engineers
  • Media

Exhibitor Profile

The profile for exhibits at Jisso ProTec 2011 includes:
  • Electronic Component Installed Machines and Related Equipment and Systems
  • Packaging Related Equipment and Systems
  • Automatic Assembly Machines
  • Semiconductor Packaging Machines and Systems
  • LCD/COG Bonding Systems
  • Inspection/Test Devices
  • Inspection/Measuring Devices
  • Packaging Design Systems
  • Packaging Devices/Components and Related Materials
  • Small Electronic Parts
  • Packaging Device Packaging Materials
  • Packaging Junction Systems
  • High Frequencies Ready Devices, Components, and Materials
  • Environment Related Devices and Materials

Organizer
Japan Electronics Packaging and Circuits Association


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