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HEAT-TEC is the prime event dedicated to heat resistance and dissipation sector, in Japan. The trade show will provide exclusive material and technologies that help in the enhancement of heat resistance and dissipation technology. Heat Resistance and Dissipation Technology Exhibition & Conference will exhibit a vast range of products including materials of heat resistance and dissipation sheet, circuit board based on aluminum, graphic sheet, machine, devices, equipments, elastomeric, etc. The attendees will be able to explore the finest products, interact with industry experts, accumulate products knowledge and develop business relations. HEAT-TEC 2011 will offer a stage for product developers, designers, R&D and purchasers of finished product to come together, discuss various industrial issue, promote new technologies and products, and explire industry market.
Visitor Profile
The targeted visitors at HEAT-TEC 2011 are:
- Automakers
- Auto Parts Manufacturers
- Electronics manufacturers
- Medical Equipments, Pharmaceuticals and Cosmetics Manufacturers
- Food & beverages Manufacturers
- Service Providers
- Distributors
- Traders
- Industry Professionals
Exhibitor Profile
The profile for exhibits at HEAT-TEC 2011 includes:
- Material of Heat Resistance and Dissipation Sheet TIM, Liquid TIM
- Circuit Board Based on Aluminium and Ceramic
- Graphic Sheet, Heat Sink, Heat Pipe, Pertier Module
- Alloy Board for Heat Resistance Aluminium/Magnesium/Coat Aluminum/Coat Steel Board
- Paint, Engineering Plastic, Elastomeric
- Machine, Devices and technology for Heat Resistance and Dissipation
- Evaluation, Inspection, Examination, equipment, Device and Various Trusts
Organizer
The Society of The Plastic Technology
