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Trade Show Directory:  Tokyo:  29th Electrotest Japan 2012

29th Electrotest Japan 2012

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Start Date 18-01-2012 End Date20-01-2012
Venue Tokyo Big Sight
City Tokyo Country Japan
Category Electronics & Electrical

Event Profile
The 29th Electrotest Japan 2012 is the largest specialized exhibition in test and inspection in electronics manufacturing and R&D. The exhibition displays latest technologies and gathers almost all the top companies from all over the world. The attendees will get a chance to meet the top company professionals in this event. The exhibition also provides outstanding business opportunities for the visitors. The expo includes sessions by famous speakers on the latest manufacturing and measuring systems. The 29th Electrotest Japan 2012 will offer a great opportunity to explore board vision inspection equipment, film thickness measurement equipment, lead frame vision inspection equipment, contract analysis services, bump vision inspection equipment, ball machine vision inspection equipment and other related products and services on the display.

Visitor Profile

Targeted visitors at the 29th Electrotest Japan 2012 are professionals from the following fields:
  • Electronics Manufacturing
  • Home Appliances
  • Personal Computer Peripheral / Office Devices
  • Audio / Visual Devices
  • Test / Inspection Equipment
  • Semiconductor Assembly
  • Automobile-related Devices
  • Optical Instrument
  • Mobile Communication Systems Devices
  • Industrial Control / Factory Automation
  • Transportation Equipment
  • Medical Devices and Others

Exhibitor Profile

The exhibitors at the 29th Electrotest Japan 2012 are manufacturers dealing in:
  • Board Vision Inspection Equipment
  • Solder Vision Inspection Equipment
  • Infrared Test Equipment
  • X-ray Inspection Equipment
  • Ball Machine Vision Inspection Equipment
  • TAB Vision Inspection Equipment
  • Bump Vision Inspection Equipment
  • IC / PCB / Components Vision Inspection Equipment
  • Lead Frame Vision Inspection Equipment
  • BGA / CSP Rework System / Equipment
  • Boundary-scan Testers
  • In-Circuit Testers
  • Functional Solder Testers
  • Testing Sockets for BGA, CSP
  • IC / LSI Testers
  • Bare Board Testers
  • Inspection jig / Test Fixtures / Probes / Testing Stages
  • Burn-in Equipment
  • 2-D / 3-D Inspection Equipment
  • Film Thickness Measurement Equipment
  • Environmental Test Equipment
  • Reliability / Evaluation Inspection Equipment
  • Analysis Equipment / Software
  • Various Measurement / Inspection / Analysis Devices
  • Other Various Testers, Inspection, Measurement Equipment and Devices
  • Contract Analysis Services
  • CCD Cameras / Other Cameras for Testing
  • Lenses

Reed Exhibitions Japan Ltd.

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