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Bondexpo 2012 is the most prominent and constant event foriIndustrial bonding technology. This is the 6th edition of the event, providing perfect business location for upcoming joining technologies. This is the perfect show for the bondage between manufacturers and suppliers of bonding, insulating, foam, sealing and encapsulation materials, as well as application equipment, and handling within the relevant application. The trade fair will remain involved in cultivating the modern and current knowledge between R&D, actual use and materials application. The 6th BONDexpo 2012 will quench the queries of attendees and exhibitors regarding industrial bonding technology, offering them comprehensive information concerning the usage and applications of the expertise.
Visitor Profile
The targeted visitors at the 6th Bondexpo 2012 are professionals associated with the following sectors:
- Automotive & Ancillary
- Construction
- Electronics
- Wood & Furniture
- Handicrafts
- Mechanical and Plant Engineering
Exhibitor Profile
The profile for exhibits at the 6th BONDexpo 2012 - Trade Fair for Industrial Bonding Technology comprises:
- Raw materials for adhesives and sealants
- Machinery
- Equipment and accessories for adhesives manufacturing industry
- Measuring and test technologies
- Services
Organizer
P.E. Schall GmbH & Co. KG
