The Electronic Components and Technology Conference (ECTC) 2010 is the most significant event in the United States meant for electronics packaging industry. The conference intends to bring about 200 engineers and scientists to discuss on the key issues related to electronics packaging industry. It will provide a unique chance for the attendees to explore leading edge developments and technical innovations across the packaging spectrum. The conference will feature high-level comprehensive programme, case studies, plenary session’s interactive panel discussion, CPMT seminar and the most relevant speakers. The show will offer an opportunity for all the professionals to adopt genuine methods to encounter the challenges in the electronic packaging industry, gain insights in to new direction and also provide a networking opportunity and face to face interaction with the leading industry players. The 60th edition of this show will discuss key topics such as assembly and manufacturing technology, components and RF, emerging technologies, advanced packaging, modeling and simulation, interconnections, optoelectronics, applied reliability and materials and processing.
The targeted visitors at the ECTC 2010 are:
- Professionals related to electronic industry
- Purchasing managers
- Potential buyers
- Trade Visitors